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Polycarbosilane
Polycarbosilane
分子量850-2500,陶瓷转化率:≥55%
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Product Overview
Related literature
Product Overview
Product Name
Polycarbosilane
CAS
62306-27-8
Security information
Related literature
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Related
HWG32176
·
[(5-Bicyclo[2.2.1]Hept-2-Enyl)Ethyl]Triethoxysilane
106398-71-4
T-95,endo/exo isomers
HWG32175
·
[(5-Bicyclo[2.2.1]Hept-2-Enyl)Ethyl] Triethoxysilane
105884-08-8
T-95,endo/exo isomers
HWG32190
·
Methacryloxymethylphenethyl Tris(Trimethylsiloxy)Silane
108587-59-3
HWG33114
·
p-(Chloromethyl)Phenylethyl Methyl Dichlorosilane
81870-64-6
HWG32501
·
1,2-Dibromoethyl Trimethylsilane
18146-08-2
95.00%
HWG32805
·
1,3-Benzodioxol-5-Yl Triethoxysilane
376353-50-3
HWG32226
·
10-(Carbomethoxy)Decyl Dimethyl Methoxysilane
1211488-83-3
95.00%
HWG32879
·
11-Phenoxyundecyl Trichlorosilane
526204-46-6
HWG33178
·
11-Pentafluorophenoxyundecyl Trimethoxysilane
944721-47-5
HWG32466
·
1-Naphthylmethyl Trichlorosilane
17998-59-3
95.00%
History
HWG60906
·
Polycarbosilane
62306-27-8
分子量850-2500,陶瓷转化率:≥55%
HWG61408
·
Boron nitride
10043-11-5
99.9% 1-2μm
HWG61503
·
Hafnium carbide
12069-85-1
99.5% 10-60μm
HWG62436
·
Titanium Nitride
25583-20-4
100-200目 激光熔覆粉
HWG62811
·
33'5,5'-tetranitro-l,1'-diaminobipyrazole
2864431-15-0
95%
HWG61707
·
Molybdenum
7439-98-7
99.9%,5-10μm
HWG00455-3
·
Hafnium Diboride
12007-23-7
≥99%,100nm-1000nm
HWG12740j
·
N/A
7440-33-7
99.99%1-3μm
HWG57425
·
NIOBIUM SILICIDE
12034-80-9
99.90%
HWG61410
·
Boron nitride
10043-11-5
直径:1μm,厚度:30-40nm,片状
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